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October 1998

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Subject:
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Oct 1998 14:31:33 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (125 lines)
Ken/Russ:

You can order the Motorola document by refering to App Note # AN1231/D
(Rev. 2, dated 11/4/96)  (Motorla Literature Distribution, P.O. Box
5405, Denver, CO 80217  Tel# 303-675-2140 or 1-800-441-2447).

In January of 1998, Paul Mescher of Amkor/Anam (1900S. Price Rd.,
Chandler, AZ 85248  Tel # 602-821-5000) wrote a document entitled "
Application Notes on Surface Mount Assembly of Amkor/Anam BGA Packages".


The latter document is also an excellent reference. Paul's paper is 20
pages in length, while the Motorola App Note is 28 pages in length.

Hope this helps....


> *********************************
> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
> ********************************
>
>
> -----Original Message-----
> From: Russ Steiner [SMTP:[log in to unmask]]
> Sent: Wednesday, October 28, 1998 11:47 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Hot: Trace width and air gap for 1mm pitch BGA
>
> Hi Ken.  Motorola has done extensive studies picking up where IBM left
> off.
> I strongly recommend that you contact your local Mot distributer and
> get
> Mot's BGA PCB packaging/layout design guidelines.  They claim that on
> a PBGA
> (plastic) one should use a soldermask defined pad.  That would be a
> soldermask opening smaller than the actual pad diameter.  On a .050
> pitch
> grid array, for example, they state to use ONLY a .023 opening on a
> pad of
> approximatley .030.  For ceramics and columns it's a diferent
> configuration
> completely.  But - get the specs from Motarola.  They appear to have
> the
> answers based on extensive studies they've done.  Regards, Russ
> Steiner
> Controls/inc.  Good luck/best wishes.
> -----Original Message-----
> From: Ken Patel <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Tuesday, October 27, 1998 3:04 PM
> Subject: [TN] Hot: Trace width and air gap for 1mm pitch BGA
>
>
> >BGA Design/process Guru,
> >We are designing board with 1mm (39.37 mils) pitch 672 pin BGA. I
> have the
> >following questions which I need urgently.
> >
> >(1) What is the recommended pad size?
> >(2) What the recommended via size?
> >(3) What will be the trace width and air gap if I need to pass 2
> traces? We
> >are limited in number layers so we want to go for double traces
> instead of
> >single trace between the pads.
> >
> >re,
> >Ken Patel
> >______________________________________________________
> >Ken Patel                       Phone:  (408) 490-6804
> >1708 McCarthy Blvd.             Fax:    (408) 490-6859
> >Milpitas, CA 95035              Beeper: (888) 769-1808
> >
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