Our customer is requiring us to use a high temp solder alloy on an
assembly, specifically Sn96 (96.5%Sn-3.5%Ag).  I've read the papers, seen
the books and listened to the salespeople.
What I need is some "real world" advice:
1)  What is a good reflow profile for this paste?  [our equpt:  convection
reflow - air]
2)  Any reliability results for comparisons?  [our assembly: 0.031" FR-4,
DS or ML, simple SMT components, TH joints with paste-in-hole, 1-3 sq-in
boards]
3)  What about interaction between PCB solder (63/37 HASL), component
solder (85/15 plate) and the Sn96 solder paste?
3)  Any general manufacturing advice from those with experience?  What to
do?  What not to do?  Look out for this!?

Thanks in advance,
John Lusk
Assembly Engineering Manager
Benchmarq Microelectronics, Inc.

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