Rick,
       I cut my teeth on this type of SMT assembly, many (we won't say how
     many) moons ago. Ceramic is more fragile and a better heat sink then
     typical FR4, so you may have to allow more time to ramp, time at peak,
     and slower cool-down, to avoid cracking, especially if substrate
     thickness is less then .030", and/or board is larger then one square
     inch. The type of conductor used for the traces may be a concern also
     (pt/pd/au? pd/ag? thickfilm vs. other?). Other then a few concerns
     like this, it actually can be a very robust process. Please give more
     info, or call me directly, and I'll be glad to answer any process
     questions.

     United Technology Electronic Controls
     Jeff L. Hempton, Sr. SMD Engineer

     Phone:  219-359-3514
E-mail: [log in to unmask]



______________________________ Forward Header __________________________________
Subject: [TN] SMT Assembly on Ceramic substrate?
Author:  Rick Thompson <[log in to unmask]> at Internet
Date:    10/27/98 9:07 AM


Hi,

One of our customers has asked us to look at assembling smt components on
ceramic substrate for them.  This is a process that we have no experience
with. If anyone can offer information regarding this process, things to
watch for, etc. it would be greatly appreciated.

TIA

                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

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