Rick,
Sorry to hear you are having these problems. We are using an old,
relatively weak no-clean (Kester 924FB) and have had no problems with TI
palladium plated components. We are also now using Alpha 310B (VOC-free),
again with no problems of the sort you are mentioning. We are also using
what I imagine are relatively standard profiles. I would guess, since you
are using a water soluble, that it contains chloride and should be quite
active. Is your problem only on one component type, maybe even one date
code? How old are the components?
regards,
Bev Christian
Nortel
> ----------
> From: Rick Thompson[SMTP:[log in to unmask]]
> Sent: Friday, October 02, 1998 10:39 AM
> To: [log in to unmask]
> Subject: [TN] Soldering Palladium plated leads
>
> Hi,
>
> With all the current discussion of solderability issues, I'm hoping some
> of
> you may be able to apply your expertise and give me some insight into a
> problem we seem to consistently have. When soldering components with
> palladium plated leads, we do not seem to get any wetting on the leads.
> It
> kind of looks like the 'footprint in mud' affect. On pcb's where we have
> this condition, all other components have soldered fine with good fillets
> and wetting. Checks of the oven profile indicate a good profile for the
> paste we're using (Kester R598, water soluble). Currently we've only
> found
> this on components from TI, so I don't know if it's only their components
> or
> the plating in general.
>
> Question: Are there any recommendations for profile, paste, process, etc.
> that differ from 'standards' when working with these types of components?
>
> Thanks.
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> [log in to unmask]
>
> (805) 584-9858 voice
> (805) 584-1529 fax
>
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