Ed

     Try adjusting the pH. Low pH gives slower plating and a higher
     Phosporous content. High pH ( eg 5 - 6 ) gives faster plating and a
     lower Phosphorous - don't push it too high or the nickel will begin to
     precipitate out, it can be brought in again by lowering the pH but it
     all gets messy.

     Hope this helps

     Chris Evans
     MBD UK



______________________________ Reply Separator _________________________________
Subject: [TN] Phosphour in Electroless Nickel
Author:  "\"TechNet E-Mail Forum.\" <[log in to unmask]>,          \"Eltek Ltd. -
Process Engineering\"" <[log in to unmask]> at INTERNET
Date:    21/10/98 07:38


I sent this message last week . No one responded . Maybe this week ?
Hi
We are running in our plant Electroless nickel - Immersion Gold  ( ENIG )
finishing for PCB based on Atotech chemistry . Phosphour content is in
middle range ( average 9% ) .
One of our customers request low phosphour content -  less than 7% .
We ae trying to force the chemistry to plate Nickel with such content of
phosphour by rising the temperature , increasing volume load ( sq cm per
liter of working solution ) etc , but untill now we do not have stable
process parameters .
Any recommendation for Atotech chemistry or someone else chemistry to
achieve the goal of phoshpour content in nickel less than 7% ???
Regards


Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

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