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October 1998

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Subject:
From:
Yongheng Zhu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Oct 1998 12:28:46 -0500
Content-Type:
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text/plain (35 lines)
Hi, all:

I got a  request to have Au plating on both side of the board with different
thickness ( one side 75 m-in and the other side 15 m-in). Try to think the
way doing that and like to ask your input.

One way is to plate Cu pattern and Au for 15 m- in both side and then mask
one side with peelable SM something, for example,  to continue Au plate the
other side; Question is whether dry film on the other side be able to
survive a couple of wet-dry cycle?

The other way is to play with plating and shield one side more. Wondering
how reliable it can be?

Third way is to coat dry film one side after Cu pattern plating without
image nothing to do Au plating, then develop 2nd coat and repeat for the
other side. But it only can be done under yellow light.

The last option to put something which easy to apply on and get off and
able to resist gold plating. Don't know what it is?

Do you have any other idea ?  Like to hear your thoughts and experience.

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