We have tried different approaches to tenting/plugging vias for BGA and some
backplane applications using LPI and screened SM with limited success...PWB
vendors claim they could do it, but we are still looking for some one who could
do this on 100% of the vias with no pin holes and it has to be done on both
sides to prevent entrapment of cleaning solutions...the via sizes that we have
in mind can have a finished hole diameter as large as 22 and as small as 13
mils...Can someone share their 'hands-on' experiences on this issue with me
through Technet or even off-line?
Thanks

Marcelo Chan
Lead Engineer - Advanced Manufacturing Technology
Electronics Systems Sector, Harris Corp., FL

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