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October 1998

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Subject:
From:
"Eltek Ltd. - Process Engineering" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Oct 1998 07:40:04 +0200
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Hi ,
We are performing solderabity tests using SERA method . You can test the
panels and not only the specimen . Contact the manufacturer , ECI at
[log in to unmask] .
Regards

At 19:59 20/10/98 -0400, you wrote:
>Hello to all the people in this list.  I hope you can help me.
>
>1. Now that the direction the industry is taking is towards the
>development of packages with reduced lead widths (primarily because of
>the shrinking package size),  is the "Dip and Look" method still the
>preferred test for Solderability Test?
>
>2. I have asked around other assembly companies and those who purchased
>the Wetting Balance system told me that they are unable to qualify the
>machine because of  "calibration problems" and never got to use it since
>it was purchased.   Do we have somebody here who encountered similar
>problems?  Was it ever resolved?  How?
>
>If there are suppliers of various Solderability Testers here, kindly
>e-mail me privately ([log in to unmask]).   Thanks a lot.
>Best Regards,
>
>
>
>Lei Tumibay
>Lead Finish Group - Assembly Engineering
>Analog Devices - General Trias
>Cavite, Philippines
>E-mail: [log in to unmask]
>
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>
Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

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