Reggie,

I remember an article published in "SMT's The Next Step" (the little
"brochure" which comes with the SMT magazine) written by Jennie Hwang.
(These "brochures" aren't dated so I can't tell you exactly which month to
look at.)  Part of the article noted the change in physical property of
solder in response to change (basically an increase) in temperature.  The
article included an interesting graph depicting this change in solder
physical property vs temperature.

I underlined the word solder because that was the main focus; not a solder
joint.  However, I believe there was some reference to solder joints.

I believe I kept this article.  If you'd like, send me your fax and when I
find it, I'll forward it to you if you'd like.

Martha Rupert
AMP Incorporated
[log in to unmask]

> -----Original Message-----
> From: Malli, Reggie [SMTP:[log in to unmask]]
> Sent: Tuesday, October 20, 1998 4:44 PM
> To:   [log in to unmask]
> Subject:      [TN] Thermal Aging Of Solder Joints
> Importance:   High
>
> Hello there!
>                 I'ld like to get some information regarding the  thermal
> aging of solder joints, particularly with the following conditions:
>
> 1.      Solder used:
>                 63/37  and 96/04 (4% silver)
>
> 2.      Product operating temperature; 187C
>
>         What I'm really looking for is the behaviour of solder joint
> strength as a function of temperature. If you have any related reports or
> literature, please email it to me or link me to the source.
>
>         Thanks for your help,
>
>         Sincerely,
>
>         Reggie Malli
>         Manager Process Engineering
>         Glenayre Manufacturing Ltd.
>         Phone: 604-293-1611
>         Fax: 604-293-4390
>         Email: [log in to unmask]
>
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