Hello to all the people in this list.  I hope you can help me.

1. Now that the direction the industry is taking is towards the
development of packages with reduced lead widths (primarily because of
the shrinking package size),  is the "Dip and Look" method still the
preferred test for Solderability Test?

2. I have asked around other assembly companies and those who purchased
the Wetting Balance system told me that they are unable to qualify the
machine because of  "calibration problems" and never got to use it since
it was purchased.   Do we have somebody here who encountered similar
problems?  Was it ever resolved?  How?

If there are suppliers of various Solderability Testers here, kindly
e-mail me privately ([log in to unmask]).   Thanks a lot.
Best Regards,



Lei Tumibay
Lead Finish Group - Assembly Engineering
Analog Devices - General Trias
Cavite, Philippines
E-mail: [log in to unmask]

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