Hi
        My question is about galvanic action on panels being fabricated.
     What I am seeing is that certain areas of panels are reacting
     differently in certain processes. These pads are internally connected
     to each other. The panel has the normal pattern plate and Ni/Au as
     well.
        The pads look different from the surrounding pads and etch at a
     much higher rate in microetch. I would like to know how common this is
     and what can be done to eliminate or at least bring it to an
     acceptable level.

     MikeDoty
     P.E. Hadco TCE

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