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October 1998

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Subject:
From:
"Malli, Reggie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Oct 1998 13:43:43 -0700
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text/plain (36 lines)
Hello there!
                I'ld like to get some information regarding the  thermal
aging of solder joints, particularly with the following conditions:

1.      Solder used:
                63/37  and 96/04 (4% silver)

2.      Product operating temperature; 187C

        What I'm really looking for is the behaviour of solder joint
strength as a function of temperature. If you have any related reports or
literature, please email it to me or link me to the source.

        Thanks for your help,

        Sincerely,

        Reggie Malli
        Manager Process Engineering
        Glenayre Manufacturing Ltd.
        Phone: 604-293-1611
        Fax: 604-293-4390
        Email: [log in to unmask]

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