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October 1998

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Subject:
From:
Mauro Nardini <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Oct 1998 10:24:31 -0700
Content-Type:
text/plain
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text/plain (113 lines)
Jeremy Drake wrote:
>
> hard plastic, or metal, or a soft rubber. The soft rubber is more prone to
> picking up debris that can be pressed into each die surface, damaging each
> device. Hard plastic, or metal can work well if the push up of the die from
> the tape and the contact with the tip is well controlled and gentle. Edge
> contact by grippers is probably the ideal, but is mechanically more
> complicated. This is a good method for things like area array flip chips.
>

Also depends on your die design. If you're using air bridges in your
die you're at a HUGE risk of damage and edge pick up using a collet is
the way to go.

> 3,   Top side damage is the obvious risk, see above, but back side, edge
> and corner damage is also possible. The needles can put microcracks in the
> die that can grow under stress. This is one reason for using rounded
> needles to push up the die that don't pierce the tape. Damage to the edges
> and corners of die by the sawing operation, flexing of the sawn wafer on
> tape, or impact damage with the edges of waffle packs can also give chip
> outs and microcracks that can grow under stress. This is particularly a
> concern with flip chip devices, where the silicon can be under high stress.
>
> 4,   When I was involved in this work over three years ago control was by
> periodic inspection. The risk was low, but if problems occured it could
> destroy large numbers of parts. I don't know if anyone has come up with a
> better method since.
>
> regards,  Jeremy Drake
> Celestica Ltd.
> Stoke on Trent
> England
> ---------------------- Forwarded by Jeremy J Drake/HQ/CUK/Celestica on
> 20/10/98 08:13 ---------------------------
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
>       to Manish <[log in to unmask]>
>
>  To:      [log in to unmask]
>
>  cc:      (bcc: Jeremy J Drake/HQ/CUK/Celestica)
>
>  Subject: [TN] Reg: Dicing operations
>
> Hello everybody
>
> I would appreciate if somebody could please help me with the following:
>
> 1.0  where could i find information about the wafre dicing practices used
> in the industry.
>
> 2.0  After the dicing opration is completed, the dice are placed in the
> waffle packs.  What kind of pick up tips are used to transfer the dice
> from the wafer to the waffle packs.
>
> 3.0  Would the transferring of the dice from the wafer to the waffle pack
> introduce damage to the top side or the back side of the dice.
>
> 4.0  What are the current practices used in the industry in order to check
> those damages.  In other words hw does one assure a defect free prodcut to
> the customer.
>
> Knowing the above is kind of urgent for me.  Therefore,
> Any help in this regard would be greatly appreciated.
>
> Regards
> Manish
>
> ---------------------------------------------------------------------------
> -
>
>     Those who do not remember the past regret it, Those who misremember
>     the past repeat it as a proof.
> ---------------------------------------------------------------------------
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