I work for a company who offers both high speed auto through-hole and
SMT placement technologies. We need to obtain information on
implementing IPC-A-610B Class III in an already existing class II
environment/process. Can anyone offer us some insight into what process
and infrastructure changes we will need to consider in order to
implement and support Class III?

Please respond to [log in to unmask] Thanks for your help in the
above matter. Ron Green

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