Hello everybody

I would appreciate if somebody could please help me with the following:

1.0  where could i find information about the wafre dicing practices used
in the industry.

2.0  After the dicing opration is completed, the dice are placed in the
waffle packs.  What kind of pick up tips are used to transfer the dice
from the wafer to the waffle packs.

3.0  Would the transferring of the dice from the wafer to the waffle pack
introduce damage to the top side or the back side of the dice.


4.0  What are the current practices used in the industry in order to check
those damages.  In other words hw does one assure a defect free prodcut to
the customer.

Knowing the above is kind of urgent for me.  Therefore,
Any help in this regard would be greatly appreciated.

Regards
Manish


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