TECHNET Archives

October 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: ICD defect
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 Oct 1998 14:09:50 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines) 
There are a couple of questions before we
can try to give advise.

Do you have a crack in the inner layer foil itself?
   If so you should
1.  check amount of etchback - too much unsupported copper foil
   can crack.
2.  check z-axis expansion
3.  check the type of foil in the board - high temp elongation or ?

Do you have separation between the inner layer and the hole wall plating?
    If so you should
1.  determine where the separation occurs - electroless/foil, electroless/
electrolytic or within the electroless
2.  then you can start addressing the various processes which could be
responsible

Susan Mansilla
Technical Director
Robisan Lab

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2