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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 2 Oct 1998 08:37:00 +0100 |
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I have not seen any mention of next years InterPack on TechNet so...
InterPACK® '99 - The PACIFIC RIM / ASME International, Intersociety
Electronic Packaging Conference
"An International Exchange of State-of-the-Art Knowledge Pertaining
to Engineering Practice in Research, Development, Manufacturing, and
Application of the Science & Technology of Packaging of microelectronics,
photonics, microwave and microelectromechanical systems"
June 13-19, 1999
Westin Maui Kaanapali Beach Hotel, Lahaina, Hawaii, USA
Further details and the final call for papers for this major
international conference is available online at:
http://members.aol.com/intpak99/intpak99.htm
David Whalley
Loughborough University
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