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October 1998

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Subject:
From:
David Whalley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Oct 1998 08:37:00 +0100
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I have not seen any mention of next years InterPack on TechNet so...

InterPACK® '99 - The PACIFIC RIM / ASME International, Intersociety
Electronic Packaging Conference

"An International Exchange of State-of-the-Art Knowledge Pertaining
to Engineering Practice in Research, Development, Manufacturing, and
Application of the Science & Technology of Packaging of microelectronics,
photonics, microwave and microelectromechanical systems"

June 13-19, 1999
Westin Maui Kaanapali Beach Hotel, Lahaina, Hawaii, USA

Further details and the final call for papers for this major
international conference is  available online at:

http://members.aol.com/intpak99/intpak99.htm

David Whalley
Loughborough University

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