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October 1998

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Subject:
From:
TOM HYBISKE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Oct 1998 07:41:23 +0000
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<color><param>7F00,0000,0000</param>>         I would like to find the through hole component land

>         macro for wave soldering process and the relation between

>         hole diameter and land size. Can anyone tell me any

>         standard available? Will the land macro be different for

>         single side or multilayer PCB?

>

>         Thanks,

>         WM Cheng


I'm not sure if this is what you're looking for, but here goes anyway:


Take drill size (finished hole size + .005") plus 2X the minimum
annular ring required (maybe .002" for outer layers) plus a
manufacturing adder, (.012" is considered reasonable by most
vendors) to reach the required land diameter.


So, assume a .032" dia. hole,


.032+.005+(2X .002)+.012=.053" <italic>minimum </italic>diameter land.


Tom Hybiske

General Atronics Corp.

Wyndmoor, PA


<nofill>

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