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Date: | Fri, 16 Oct 1998 07:41:23 +0000 |
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<color><param>7F00,0000,0000</param>> I would like to find the through hole component land
> macro for wave soldering process and the relation between
> hole diameter and land size. Can anyone tell me any
> standard available? Will the land macro be different for
> single side or multilayer PCB?
>
> Thanks,
> WM Cheng
I'm not sure if this is what you're looking for, but here goes anyway:
Take drill size (finished hole size + .005") plus 2X the minimum
annular ring required (maybe .002" for outer layers) plus a
manufacturing adder, (.012" is considered reasonable by most
vendors) to reach the required land diameter.
So, assume a .032" dia. hole,
.032+.005+(2X .002)+.012=.053" <italic>minimum </italic>diameter land.
Tom Hybiske
General Atronics Corp.
Wyndmoor, PA
<nofill>
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