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October 1998

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Subject:
About Wire Bonding
From:
ccfswr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Oct 1998 16:34:42 +0800
Content-Type:
text/plain
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text/plain (32 lines) 
        H i Techneter :

      I have two questions.

      1. Why the wire bonding process which needs gold deposit on the
  substrate ?

      2. Why the gold wire bonding which needs thicker gold deposit than
  alumium wire bonding ?

       Please advise me.

       Thanks for your help


                                                        Alex Liao
ccfswr , 10/14/1998 PM 4:34
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