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October 1998

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Subject:
From:
Sira Rikulsurakan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Oct 1998 04:07:37 +0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Dear Technetter.
        We are facing Solder Ball problem for SMT No-Clean process. The
balls are always in contact with 0603 Chip capacitor and resistor and also
fixed by flux. Diameter of the balls is less than 5 mils.
        Stencil thick is 6 mils. Stencil apertures of the 0603 component are
home plate shapes. Solder paste thickness is about 7.4 mils.
        We had extended preheat portion of reflow profile to cure solder
paste and reduce peak temperature of reflow portion to stop splash but
solder balls are still found after reflow.
        Would anybody please suggest us how to eliminate the solder balls.
Thank you.
Mark.

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