On behalf of the International Microelectronics and Packaging Society (IMAPS) Rocky Mountain Chapter, I would like to invite you to our upcoming Fall 1998 Technical Joint IMAPS/SMTA Meeting. 

The meeting theme is:
"Emerging Technologies in PCB Design/Fabrication & Assembly" 
DATE:   Thursday, October 22, 1998
LOCATION:   Lucent Technologies, Mt. Elbert Room, 1200 W. 120th Ave. Westminster, Co. 80234
Registration begins at 8:30 a.m. ; Presentations at 9:00 a.m. ; Lunch from 11:45 a.m. to 12:45 p.m. ; Presentations concluding by 4:00 p.m..    

The a.m. Presentations include:
" Designing Out EMI Using Microvia Techniques "  by Steve Bird - General Manager - Hadco Design Div.
" CAD/CAM Tools For Improved Design For Manufacturability"  by Brian Oliver & Steve Krause & Associates - Valor Computerized Systems/Veribest/Design Plus Assoc.
" New Innovations in High Density Interconnects - At Last ! "  by Jim Leonard - Program Director - Colorado Advanced Technology Institute

The p.m. Presentations include:
" Innovative Ways to Use the Internet to Increase the Efficiency of the Value Chain i.e. Engineers Domain, Component Obsolence Program, Quality Input Connection etc. "  by Brian Tracey - V.P. of Strategic Enterprise Value Chain Management - EFTC Corporation
" Fine Line PCB Assembly Leads to New Test Issues "  by Mike Teska - Manufacturing Test Division - Hewlett Packard
" High Density Interconnect Structure - MicroVia Technology "  by Dave Wolf - Field Application Engineer - Hadco Corporation

Do Not Miss This Opportunity To Remain 
" At The Forefront Of Technology "
$ 20.00 for SMTA/IMAPS Members
$ 25.00 for Non Members
$   5.00 for Students
( Continental Breakfast & Lunch Included ) 

If you have any questions or comments please feel free to contact me.

Thank you,

Brian C. Hunter, IMAPS Secretary
University of Colorado
[log in to unmask]

Note: If you are interested in joining IMAPS, you can e-mail me for an application or sign up on line at www.imaps.org

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