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October 1998

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Subject:
Component Baking Guideline
From:
Jeff Hempton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Oct 1998 08:31:42 -0500
Content-Type:
text/plain
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text/plain (50 lines) 
     Ken,
       Specification from IPC, #IPC-SM-786A, details criteria for moisture
     sensitive devices and baking requirements. Good luck.

     United Technologies Electronic Controls
     Jeff Hempton


______________________________ Forward Header __________________________________
Subject: [TN] Component Baking Guideline
Author:  Ken Patel <[log in to unmask]> at Internet
Date:    10/13/98 10:41 AM


Does IPC has guideline for component baking?  If any in the process, please
let me know too.

re,
Ken Patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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