James
The following was posted by Hugh Scott Miller at the end of July. I do recall a formated document which covered the same ground being posted earlier than that...but can find no trace in my archive. Hope this is of help.

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Once again, I would like to thank all the people that have participated
and volunteered their time to give me additional ideas specific to the
content of my company's supplier survey form.  Some of you have
requested that I post the end result of this discussion, and I have
gratefully.  Below is the collective wisdom of several people in
Technet, and if there are any last minute changes I should include,
please speak now or forever hold your peace.  Thanks again everyone.

Supplier Survey

Company Name
Company Address1
Company Address2
Country
Zip Code

Telecommunications

Telephone
Fax Number
Modem Number
Email Address
Web Site Address

Personnel

CEO
Quality Manager
Engineering Manager
Sales Manager
No of Employees
# of Purchasing Personnel
# of Engineering Personnel
# of Quality Personnel
# of Production Personnel
# of Production Control/Distribution Personnel
# of Tool Making/Maintenance Personnel
# of Administrative Personnel
# of Others

Manufacturing Focus

Min # of Layers
Max # of Layers
Min Line Width (internal)
Min Line Width (external)
Line-to-Line Clearance (internal)
Line-to-Line Clearance (external)
Line-to-Land Clearance (internal)
Line-to-Land Clearance (external)
Min. Hole Size
Min. SMT Pitch
Max. Panel Size
Aspect Ratio


Product Mix

S/S (% of Capacity)
D/S (% of Capacity)
Multilayer  4-6 layers (% of Capacity)
Multilayer 8 + layers (% of Capacity)
Flex & Rigid Flex (% of Capacity)

Basic Plant Data

No. of Shifts
# of Hours per Shift
# of Work Days/Year
# Work Days/Week
# of Holidays and Vacations Days
Total Sq' of Capacity per day
Total SQ' of Capacity per Month
Manufacturing area/Sq Feet
Current % of Capacity being Used
Sq Footage of Facility
Plant Character (High Volume, Medium Volume, Low Volume, Prototype)
Average Leadtime (Production Parts)
Average Leadtime (First Article)
SPC Program In-Place
Customer Approvals

Capacity Expansion Plans

Current Capacity
6 Month Plan
12 Month Plan
24 Month Plan

Design Capabilities

Computer Aided Engineering  & Equip
Computer Aided Design & Equip
Laser Plotter
Version of Gerber

Computer Aided Design Details

ACCEL Technologies
AutoCAD
Best Proto
Cadence
CADint PCB
Data I/O (Synario)
HP RF Board Designer
Intergraph
McCAD
Mentor Graphics
MicroSim
OrCAD
PADS Software
Protel
Ultiboard
VeriBest
Viewlogic
Visionics (EE Designer)
Xynetics
Zuken-Redak

Electrical Testing

Dedicated Test Fixture
Automatic Test Fixture

Special Technologies

Blind Vias
Buried Vias
Microvia Rigid
Microvia Flex
Microvia-Laser
Microvia-Plasma
Photovia
Carbon Ink
COB
BGA
Backpanel
Flexible
Flex-Rigid
IVH
Hot Air Level
Hot Oil Level
RF Microwave
Thin Core
Buried Capacitance
Buried Resistance
Controlled Impedance
Plugged Vias

Processes

Additive
Semi-Additive
Subtractive
Thin Film
Thin Foil
Thick Film

Base Materials

Phenolic
Glass Paper
Epoxy Paper
Epoxy Glass
Polyimide Composite
Polyimide Glass
Cyanate Ester
Flex Materials
Teflon
BT Epoxy
PPE
High performance epoxy
PTFE
RCC
Polyimide
Silicon/Glass
Polyphenylene Ether/Glass
Aramid fiber laminates-Woven
Aramid fiber laminates-Paper
Insulated Metal Substrate
Glass Reinforced Hydrocarbon Ceramic Laminate

Heat Sink/Stiffeners

Copper-Invar-Copper
Copper-Moly-Copper
Copper-Carbon-Copper
Aluminum
Copper
Aluminum-Silicon Carbide
Beryllium
Beryllium-Beryllium Oxide
Aluminum-Beryllium

Soldermask

Dry Film
Image Transfer
LPI

Drilling

Small Hole
Laser Drill

Hard Tooling

Blanking
Pierce

Routing

NC Route
Pin Route
Perforate
Laser Score
V-Score
Shear Only

Electrical Test

Dedicated
Clamshell
Contiunity
Flying Probe
Net List

Coatings

Conformal
Organic
Paraxialine
Solder
OSP

Plating

Copper
Tin
Tin/Lead
Tin/Nickel
Tin/Nickel Alloy
Nick/Gold (Hard)
Nick/Gold (Immersion)
Nick/Rodium
Full Body Nickel
Full Body Gold
Selective Plating
Palladium
Palladium-Alloy
Silver
Bismuth

Finishes

Electroless Nickel Gold
Immersion Silver
Electroless Nickel
Immersion Gold
Electroless Palladium
Brushed Tin Lead
Electroless Tin
Solder Fused
Flux
Roll Solder
Tin/Lead Fused
Triazode
Entek

UL Approvals

UL Single Sided
UL Double Sided
UL Multilayer
Approv # of Layers

International Approvals

CSA
IECQ
ISO 9001
ISO 9002
ISO 9003
ISO 14000
QS-9000
ESA (European Space Agency)
VDE

Raw Material Data

Thin Laminate Suppliers
Thick Laminate Suppliers
Copper Foil Suppliers
Prepreg Supplier
Etchant Supplier
Soldermask Supplier

Basic Equipment Data

# AOI Inspection Equipment
# of Drilling Machines
# of Plating Lines (Pattern/Panel/Tenting)
# of Plating Lines (Nickel, Gold, etc)
# of Routing Machines
# of Punching Machines
# of Scoring Machines
# of Electrical Test Stations
In-House Lamination


Finanicial Data

Terms:  Net Days
Currency:
Dun & Bradstreet #
Years in Business
Annual Revenues
% of Revenue Reinvested in Plant Annually


Regards
Ian Squires
Senior Production Engineer
-------------------------------------------------------

Graseby Dynamics Ltd
A Smiths Industries Company
Park Avenue, Bushey, Watford, Herts, WD2 2BW
Web Site: www.gradyn.co.uk
Phone:    01923-228566 xt 295
Fax:      01923-221361
E-mail:   [log in to unmask]

Registered in England no. 480992
Registered office:
765 Finchley Road, London, NW11 8DS
-------------------------------------------------------

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