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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 13 Oct 1998 15:24:31 -0600 |
Content-Type: | multipart/mixed |
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Tom,
I'd be worried about standoff height and joint shape with the wave approach.
Someone suggested spacers which would help with the standoff, but you might get
a nasty joint shape that will cause reliability problems. I'd definitely try
it if you're backed into a corner, but plan on some sectioning to make sure
it's reliable.
Rod Martens.
Hi everyone,
I just thought of something else that might work.
Since the pads are thru-hole, can I just place the component on top and
run it through wave? Since the pads are plated thru-hole, solder will
come up and create a joint with BGA balls.
Any input would be greatly appreciated.
Tom Han
Ardent Systems
__________________________________________________
Rod Martens
Process Technology Engineer
Hewlett-Packard Company
3400 E. Harmony Rd. MSA5-6L
Fort Collins, CO 80528-9599
(970)898-7709
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