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October 1998

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Subject:
From:
Rod Martens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Oct 1998 15:24:31 -0600
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BDY.TXT (887 bytes)
Tom,
I'd be worried about standoff height and joint shape with the wave approach.
Someone suggested spacers which would help with the standoff, but you might get
a nasty joint shape that will cause reliability problems.  I'd definitely try
it if you're backed into a corner, but plan on some sectioning to make sure
it's reliable.
Rod Martens.




Hi everyone,

        I just thought of something else that might work.

        Since the pads are thru-hole, can I just place the component on top and
        run it through wave?  Since the pads are plated thru-hole, solder will
        come up and create a joint with BGA balls.

        Any input would be greatly appreciated.

        Tom Han
        Ardent Systems

__________________________________________________
Rod Martens
Process Technology Engineer
Hewlett-Packard Company
3400 E. Harmony Rd. MSA5-6L
Fort Collins, CO 80528-9599
(970)898-7709
[log in to unmask]



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