Tom,

Before you try it, I would really think this through...wave soldering will
reflow the part, but when the BGA balls collapse, two thigs are likely to
happen, the BGA will collapse onto the board with minimal stand-off and lots of
bridging.....  i would place solder into the holes via a soldering iron, attach
temporary spacers to ensure appropriate BGA stand-off and then assemble it as
SMT.... stenciling the solder may be affected by the rework, but you don't have
many choices now...also depending on the thickness of your card, you may want to
place the solder in the holes while the board is pre-heat to at least 90 deg. C
or so to reduce PWB stress....

Good luck

Marcelo

        -----Original Message-----
        From:   Thomas C Han [SMTP:[log in to unmask]]
        Sent:   Tuesday, October 13, 1998 4:13 PM
        To:     [log in to unmask]
        Subject:        [TN] BGA on thru-hole pads

        Hi everyone,

        I just thought of something else that might work.

        Since the pads are thru-hole, can I just place the component on top and
        run it through wave?  Since the pads are plated thru-hole, solder will
        come up and create a joint with BGA balls.

        Any input would be greatly appreciated.

        Tom Han
        Ardent Systems

        ___________________________________________________________________
        You don't need to buy Internet access to use free Internet e-mail.
        Get completely free e-mail from Juno at http://www.juno.com
        or call Juno at (800) 654-JUNO [654-5866]

        ################################################################
        TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
        ################################################################
        To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
        To subscribe:   SUBSCRIBE TechNet <your full name>
        To unsubscribe:   SIGNOFF TechNet
        ################################################################
        Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
        For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
        ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################