And of course this book is available from the SMTA. SMTA members can buy
it for $64.95 (look! It's $.05 cheaper!), and non-members for $84.95.
Order via http://www.smta.org.
UPS ground shipping is free!
Regards,
-David
At 12:21 PM 10/1/98 -0400, you wrote:
>Don't forget about the wire bonding bible:
>
>Wire Bonding in Microelectronics Materials, Processes, Reliability & Yield
> George Harman
> ISBN: 0-07-032619
> IMAPS Member: $65, Nonmember: $115
>
>http://www.imaps.org/pubs.htm
>
>
>
>
>----------
>From: Terry Regan [SMTP:[log in to unmask]]
>Sent: Wednesday, September 30, 1998 3:35 PM
>To: [log in to unmask]
>Subject: Re: [TN] Fab: Multiple surface finishes
>
>Glenn and Michael,
> It is true that 30u" is typically an acceptable gold thickness for
>thermosonic bonding. In fact, we have customers that have had tremendous
>success bonding to 17u". There are many criteria which can affect the
>bondability including the Nickel underlay, the pourosity of the Nickel and
the
>Gold platings, the chuck temperature, the plasma cleaning process, etc. The
>real catch is understanding and characterizing your bonding equipment with
the
>product supplied by your substrate manufacturer. Performance of a given
>thickness of gold from one supplier is probably not the same as that
thickness
>from another supplier. There is a definite need to form a relationship with
>your supplier and work with them to define the optimum parameters. A DOE
would
>probably do the trick. (then don't let your buyers go on a "price" hunt for
>suppliers)
>
>Terry Regan
>HADCO
>
>____________________Reply Separator____________________
>Subject: [TN] Fab: Multiple surface finishes
>Author: "Alderete; Michael" <[log in to unmask]>
>Date: 9/30/98 2:44 PM
>
>Glenn-
>
>Hadco (Watsonville CA) recently talked us into 30 microinches Au, vs.
>our original 50 microinch callout, on BT laminate. We established that
>reliable Au wire wedge bonds could be made at 30, before we approved the
>order. We're now thinking that we could make good wire bonds to
>something less than 30, but we haven't tried. Maybe Hadco (or someone
>else) can recommend minimum Au plating for Au wire bonding AND
>(eutectic) soldering.
>
>-Michael Alderete
>
>
>You wrote...
>------------------------------
>
>Date: Wed, 30 Sep 1998 10:31:54 PDT
>From: glenn pelkey <[log in to unmask]>
>Subject: Fab: Multiple surface finishes
>
>Hello all,
>
> I'm looking for information on how to build a board with both soft
>gold and solder as outer layer surface finishes. We want to make sure
>it is manufacturable before designing it. The only thing I have now are
>examples with edge connectors. The gold and solder would be at select
>locations throughout the board.
>
> In case you're wondering why, I'll tell you. We want to increase
>the gold thickness to greater than 70 microinches for wire bonding.
>But, this product also has screened solder for SMT. Since sceening
>limits the amount of solder, gold embrittlement becomes an issue. I
>calculated 3.7% of gold by weight at 70 microinches. I know opinions
>vary here, but I think everyone can agree that this is at least a
>concern.
>
> What do you think? How hard is this to do? Contamination,
>increased cost, other reliabilty or quality issues to trade off?
>
>Thanks for all your help.
>
>Glenn Pelkey
>Maxtek Components Corp.
>[log in to unmask]
>[log in to unmask]
>
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>Get Your Private, Free Email at http://www.hotmail.com
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David Gonnerman
Director of Publications
Plan now to attend:
*Electronics Assembly Expo*
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SURFACE MOUNT TECHNOLOGY ASSOCIATION
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