Terri,
You have a tough job ahead! This is no longer a simple ceramic to plastic
conversion. Now you have to integrate hermetic ceramic, non-hermetic
ceramic, plastic BGA, mini BGA, Micro BGA, TSOP, PQFP, SO, and many more
into your systems. Isn't this COTS program fun? You have only seen the
beginning. The next few years will be even worse. I have heard that there
are some 30 companies working on wafer bumping services. Chip scale is not
far behind BGA.
A few good places for information:
MEPTECH '98
Microelectronics Packaging Technology Symposium
November 10th and 11th
San Jose, CA
www.mepteconline.com
Motorola's web site and technical library. They have some very good
technical papers posted here.
www.mot.com
Abstracts from SMI conferences.
http://www.smtnet.com/bookstore/
Also check out our SolderQuik products at:
http://solderquik.com
The Solderquik CCMD and CGA will allow you to mount LCC's or BGA's to any
PWB.
Hope this helps a little
Russ
>-----Original Message-----
>From: Neubauer, Terri <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Date: Friday, October 09, 1998 10:33 AM
>Subject: [TN] Ceramic vs. Plastic Components
>
>
>>Greetings TechNetters!
>>
>>My company is able to custom design PWBs with low surface CTE for use in
>>military / space environments. Then along come the plastic parts. I have
>>been tasked with determining how to best use ceramic and plastic parts on
>>the same PWB. As I am a material engineer, I am not that familiar with
>>component parts and their sources. However, I am all too familiar with CTE
>>mismatches in general and realize that this is a major part of this
>specific
>>problem.
>>
>>1. What are some good information sources? (Companies, web sites,
>>papers, etc.)
>>2. What design issues should I focus on?
>>3. What board manufacturing issues are there to consider?
>>4. What assembly headaches are looming in my future?
>>
>>I would greatly appreciate any and all guidance on these issues.
>>
>>Thanks in advance!
>>
>>Terri Neubauer
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