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October 1998

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Subject:
From:
Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>
Reply To:
TechNet E-Mail Forum. <[log in to unmask]>
Date:
Tue, 13 Oct 1998 14:42:43 +0200
Content-Type:
text/plain
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text/plain (31 lines)
> Hi Techies,
> we had following occurence with OSP-boards (Entek+) & throug hole
> components (THC):
> 1.reflow, then wave solder the THC: The THC have a nice solderjoint,
> which is not going throughout the hole. According to our design rules,
> this is a bad joint.
Is that singular for ENTEK?

This behaviour may prevent the usage of OSP, because the rules are somehow
holy.

> Any comments or suggestions?
>
> Wolfgang Nuechter
> Robert Bosch
> Germany
>
>

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