Terri-

I believe that LEADED ceramic parts should be ok on regular (PI or FR-4,
etc.) organic laminate PWB, along side with plastic ICs. LEADLESS
ceramic parts must be on controlled CTE (i.e., lower CTE than FR-4,
lower than ~ 18 ppm/deg C) PWB, which should be ok with leaded plastic
ICs.

Michael Alderete



You wrote...
------------------------------

Date:    Fri, 9 Oct 1998 12:30:17 -0400
From:    "Neubauer, Terri" <[log in to unmask]>
Subject: Ceramic vs. Plastic Components

Greetings TechNetters!

My company is able to custom design PWBs with low surface CTE for use in
military / space environments. Then along come the plastic parts.  I
have
been tasked with determining how to best use ceramic and plastic parts
on
the same PWB.  As I am a material engineer, I am not that familiar with
component parts and their sources. However, I am all too familiar with
CTE
mismatches in general and realize that this is a major part of this
specific
problem.

1.      What are some good information sources? (Companies, web sites,
papers, etc.)
2.      What design issues should I focus on?
3.      What board manufacturing issues are there to consider?
4.      What assembly headaches are looming in my future?

I would greatly appreciate any and all guidance on these issues.

Thanks in advance!

Terri Neubauer

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