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October 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Oct 1998 13:50:26 -0500
Content-Type:
text/plain
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text/plain (70 lines)
Hi Scott - The bromines/bromides that are a component of the FR4 flame
retardant chemistry TYPICALLY don't cause electronic assembly problems.
Give Doug Pauls at CSL Inc. an email ([log in to unmask]). Doug is heavily
involved with ionic contamination from both the IPC technical committees
and  an electronics assembly residue analysis standpoint. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





Ozark Circuits <[log in to unmask]> on 10/12/98 10:03:33 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Ozark Circuits <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] Ionic Contamination due to No-Clean Fluxes




I have a customer who is concerned about Ionic contamination due to
bromines/bromides. I have explained to the customer that the flame
retardant in FR-4 material is based on bromine. Also, the flux that we use
for the HAL is Hydrobromic Acid based, this is used instead of Hydrochloric
Acid based flux to cut down on the chloride contamination.

If anyone has information concerning this subject, I would appreciate any
and all information. I can be contacted at:

Scott Foley
Environmental & Process Manager
Ozark Circuits, Inc.
933 W. Chase
Springfield, Missouri 65803
Phone: 417-864-5004
Fax:   417-864-4072
email: [log in to unmask]

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