I have the exact same situation - PCB manufactuer asking customers to convert
over to "Immersion White Tin"; Please let me know what you find - I will be
following your thread -

Brian Rusten wrote:
>
> Dear Technettes
>
> One of our PCB Manufacturers has recently started using the "Omikron"
> (Immersion White Tin) process as an alternative to Hot Air Leveling.
> They are asking us (the designers) whether they can use it for our boards.
>
> I've looked through the archives, and there seem to be no major problems
> noted so far. Still, it's a couple of months since it's been discussed,
> and it is a new(ish) process. So, here goes :
>
> Does anyone know of any particular adverse design or assembly implications
> of using this process? Do you know (even as hearsay) of any problems with
> the process?
>
> Thanks, and Regards
>
> Brian Rusten
>
> Contract PCB Design Engineer
> JNA Telecommunications Ltd  Ph (02) 9935 5777      Fax (02) 9417 3862
> (Now "A Lucent Company")
>
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