TECHNET Archives

October 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
James Kittel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Oct 1998 10:04:50 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (83 lines)
I have also seen that problem, especially on epoxy encapsulated
magnetics.  I suspected it was a mold release material but never
investigated.  The question is, if it is an insulating material, why
coat it?

>-----Original Message-----
>From:  Bridget Piper [SMTP:[log in to unmask]]
>Sent:  Monday, October 12, 1998 8:31 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] Confomal coating adhesion
>
>I have been informed that several fine coats rather than one
>thicker coat improves adhesion, however, I have no practical
>experience of it to back this up. Might be worth a try, but it
>will increase your process time. And yes, cleanliness is an
>issue. i suggest you approach your supplier.........Bridget
>
>
>> -----Original Message-----
>> From: Paul Stolar [SMTP:[log in to unmask]]
>> Sent: 12 October 1998 15:09
>> To:   [log in to unmask]
>> Subject:      [TN] Confomal coating adhesion
>>
>>                    *** WARNING ***
>>
>> This mail has originated outside your organization,
>> either from an external partner or the Global Internet.
>>      Keep this in mind if you answer this message.
>>
>>
>>      Does anyone have any good experience at improving
>> conformal coating
>>      adhesion to plastic packaging?
>>
>>      Is it a cleanliness issue, or is it inherent in materials?
>>
>> ###############################################################
>> #
>> TechNet E-Mail Forum provided as a free service by IPC using
>> LISTSERV 1.8c
>> ###############################################################
>> #
>> To subscribe/unsubscribe, send a message to [log in to unmask]
>> with following text in the body:
>> To subscribe:   SUBSCRIBE TechNet <your full name>
>> To unsubscribe:   SIGNOFF TechNet
>> ###############################################################
>> #
>> Please visit IPC's web site (http://www.ipc.org) "On-Line
>> Services" section for additional information.
>> For technical support contact Hugo Scaramuzza at [log in to unmask]
>> or 847-509-9700 ext.312
>> ###############################################################
>> #
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
>text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
>for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
>847-509-9700 ext.312
>################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2