In a message dated 10/1/98 8:11:35 AM Pacific Daylight Time,
[log in to unmask] writes:

<< Steve,
        What would you use x-ray for on initial set-up of a process?

        If process is verified during the initial set-up (for arguments sake
 we can say by x-ray) --What were you intending to tell you that it was under
 control while running, How would you monitor it?
 Semper Fi
 Tom >>

Hi Tom,

     What I would use it for on initial set-up, is to verify placement after
reflow, and that there were no really unusual voids, bridges, or things of
that sort beneath the package. I know the jury is still out on what it is you
see with xray being a defect or not.

     As far as what I would monitor during the rest of the process, one would
assume that if I were making sure that I was putting the proper amount of
paste down accurately, placing the components in the same place I did on my
first board, and using the same reflow profile that I used on my first board,
I should obtain the same results...no?

-Steve Gregory-

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