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October 1998

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Subject:
From:
Lisa Williams <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Oct 1998 13:17:51 -0500
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Colleagues:

IPC will hold the first meeting of a new Task Group which will be looking to expand
on the MIL-D-275 current carrying capacity charts. The following is a list of
questions for the task group to tackle:
How to do the following effect the thermal properties of a conductor/board area?
1)  orientation of board -verticle (conductors on top vs. bottom) vs. horizontal
2)  length of conductors (shorter)
3)  pads & leads (adding components; heat generator or heat sink)
4)  width vs. thickness (form factor)
5)  dielectric material  -negligible
6)  conductor material effect (electrodeposition, foil, plating)
7)  adjacent conductors
8)  internal vs. surface conductors

The new task group will be meeting on Tuesday, October 27 - 5:15pm - 6:30pm during
IPC/SMTA Electronics Assembly Expo in Providence, RI. Interested parties are invited
to attend and/or send their comments to the IPC.

For more information visit our website...click on the component labeled IPC/SMTA
Electronics Assembly Expo.


Lisa Williams
Technical Project Manager
IPC
2215 Sanders Road
Nortbrook, IL  60062
www.ipc.org

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