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October 1998

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Subject:
From:
"Shadler, Jeffrey" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Oct 1998 13:40:45 -0400
Content-Type:
text/plain
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text/plain (30 lines)
Hello Technet!

Questions: I was wondering if any of you out there are building PCB
assemblies with a cyanate ester e-glass laminate (PWB)? If so, are you
altering your reflow or wavesolder processes to accomidate this
laminate? Has delamination ever been an issue with this laminate?

Problem: We are experiencing delamination at the bare board and
assembled board levels, even during the pre-bake stage.

We are taking all steps to verify our processes as well as working with
the vendor to solve this issue. Any suggestions, hints, or general
observations would be appreciated.

Regards,

Jeffrey Shadler

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