I had a lot of 15 boards that I mounted PBGA388 (35mmX35mm), using
Conceptronic BGA rework station.  As I was observing the reflow, I
noticed  bowing of the plastic laminate on the corners of the component.
Once the component was reflowed, it became level with the PCB, but the
bowing action caused several shorts between the balls under the corners.
Any suggestions on how to correct the problem?  The inspection following
the reflow reveal good wetting and reflow on rest of the balls.


Tom Han
Ardent Systems

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