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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 9 Oct 1998 13:17:51 -0500 |
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Colleagues:
IPC will hold the first meeting of a new Task Group which will be looking to expand
on the MIL-D-275 current carrying capacity charts. The following is a list of
questions for the task group to tackle:
How to do the following effect the thermal properties of a conductor/board area?
1) orientation of board -verticle (conductors on top vs. bottom) vs. horizontal
2) length of conductors (shorter)
3) pads & leads (adding components; heat generator or heat sink)
4) width vs. thickness (form factor)
5) dielectric material -negligible
6) conductor material effect (electrodeposition, foil, plating)
7) adjacent conductors
8) internal vs. surface conductors
The new task group will be meeting on Tuesday, October 27 - 5:15pm - 6:30pm during
IPC/SMTA Electronics Assembly Expo in Providence, RI. Interested parties are invited
to attend and/or send their comments to the IPC.
For more information visit our website...click on the component labeled IPC/SMTA
Electronics Assembly Expo.
Lisa Williams
Technical Project Manager
IPC
2215 Sanders Road
Nortbrook, IL 60062
www.ipc.org
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