DESIGNERCOUNCIL Archives

October 1998

DesignerCouncil@IPC.ORG

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Sender:
DesignerCouncil <[log in to unmask]>
X-To:
Lisa Williams <[log in to unmask]>
Date:
Fri, 9 Oct 1998 14:36:02 -0400
Reply-To:
"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Garry Hammond <[log in to unmask]>
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From:
Garry Hammond <[log in to unmask]>
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Lisa,

What about the effects of blowing air over the board surface??

I just finished a board that sits in front of a fan, yet has high current flowing thru it.

Thanks, Cheers, Garry Hammond


Lisa Williams wrote:

> Colleagues:
>
> IPC will hold the first meeting of a new Task Group which will be looking to expand
> on the MIL-D-275 current carrying capacity charts. The following is a list of
> questions for the task group to tackle:
> How to do the following effect the thermal properties of a conductor/board area?
> 1)  orientation of board -verticle (conductors on top vs. bottom) vs. horizontal
> 2)  length of conductors (shorter)
> 3)  pads & leads (adding components; heat generator or heat sink)
> 4)  width vs. thickness (form factor)
> 5)  dielectric material  -negligible
> 6)  conductor material effect (electrodeposition, foil, plating)
> 7)  adjacent conductors
> 8)  internal vs. surface conductors
>
> The new task group will be meeting on Tuesday, October 27 - 5:15pm - 6:30pm during
> IPC/SMTA Electronics Assembly Expo in Providence, RI. Interested parties are invited
> to attend and/or send their comments to the IPC.
>
> For more information visit our website...click on the component labeled IPC/SMTA
> Electronics Assembly Expo.
>
> Lisa Williams
> Technical Project Manager
> IPC
> 2215 Sanders Road
> Nortbrook, IL  60062
> www.ipc.org

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