Hi everybody,
1) Would like to gather more information for board layout for EMC especially for
high speed and mixed signals. Can any body submit your list or provide me with
place that i can get this information ?

2) Right now  I am using via size with 12 mils drill size, what is the minimum
pad size that I need to maintain on each size of the via. Also, for  multi-layer pcb
( 4 layers and above ), for internal layers, can I maintain the same pad size for via
as in top and bottom layer, or is it better to open it biggger ?

Thanks & Best Regards,

################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe:   SIGNOFF DesignerCouncil 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################