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September 1998

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Subject:
Re: Drop off Component
From:
James Kittel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Sep 1998 13:17:16 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (50 lines) 
I saw a similar situation with 'D-Pack' devices.  The defects appeared
totally random, but were related to solder voids at the heat sink tab.
What kinds of parts are you seeing this with and what kind of solder
paste are you using?


>-----Original Message-----
>From:  Poh Kong Hui [SMTP:[log in to unmask]]
>Sent:  Tuesday, September 29, 1998 4:30 PM
>To:    [log in to unmask]
>Subject:       [TN] Drop off Component
>
>Hi Technetters,
>
>I am facing with an issue that the component at the bottom side of
>the board drop-off during the second-pass reflow process. However,
>such incident happen randonly.
>
>Could anyone advise me how to resolve such problem ? Thanks
>
>
>Poh
>
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