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September 1998

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Subject:
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Sep 1998 09:19:46 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (25 lines)
With regards to the reference of less than 100 microinches of gold, not
posing any embrittlement problems, the accepted maximum thickness for
soldering onto gold is 10 microinches, of gold. Thicker gold plate will
produce gold embrittlement issues. Why would you want more than 10
microinches of gold, if you are going to solder bond, 6-10 microinches
affords good enough nickel antitarnish protection.

Regards,

Lenny Kurup
EMX Enterprises Ltd.
Markham, Ontario, Canada

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