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September 1998

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Subject:
Via fill
From:
"Frank K. Frimpong" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Sep 1998 16:39:26 +0000
Content-Type:
text/plain
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text/plain (15 lines) 
Can anybody provide me with the IPC levels of acceptence as to what
percentage of vias have to be filled with resin..

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