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September 1998

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Subject:
From:
"Hamilton, Richard -4454" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Sep 1998 13:42:38 -0700
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Hello all,

I am looking for feedback on anyones experience in dual mode (SM and TH)
manufacturing.

We have one SM device, QFP, located in the middle of the PWB with other
components surrounding it. We want to reflow the QFP, and then do other
placements and then wave solder. We are evaluating masking methods for the
QFP in the wave process.

I would appreciate any feedback on methods tried, and results experienced.
If you have a very positive experience with a specific vendor, I would not
mind receiving that info also.

I appreciate in advance the response and your time in this.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

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