TECHNET Archives

September 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Solder Bumping
From:
Craig McGlinchy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Sep 1998 08:55:09 +1200
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Hi All,

I am trying to find out if it is possible to get solder bumps (as on a bga)
place on a PCB, the pitch of the solder bumps would be 0.8mm, and the
diameter of the bump approx 0.5mm.

Thanks

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2