TECHNET Archives

September 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Smith Russell MSM LAPO US <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Sep 1998 04:06:00 +0200
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1213 bytes) , application/ms-tnef (2034 bytes)
Try MicroVia Inc. In Florida
Kim in inside sales can point you to the proper person to talk to.
407-699-5000
 ----------
From: Achim Neu
To: [log in to unmask]
Subject: [TN] Boardsubstrates for RIMM module
Date: Monday, September 28, 1998 10:10PM

Hello people,

does somebody knows a company who supplies RIMM module to the market ?
This module has some special requirements relating to the electrical
performance for high frequencies like 8 layer structure with total
thickness below 1,27 mm and 250µm vias.

Any hint is appreciated.
Achim

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2