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September 1998

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Subject:
Re: Vias in chip components pads?
From:
"Kelly M. Schriver" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Sep 1998 15:02:36 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Hi Scott -

The via in pad is a problem UNLESS it's a microvia which only goes a layer or
two deep in the board.  Vias which go all the way thru the board will steal
solder from the connection you're trying to make on one side, then turn that
same solder into a nice spherical bead on the opposite side.

The inspectors and touch up people, in turn, have lifetime job security.

Regards - Kelly

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