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September 1998

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Subject:
From:
PELCHAT_JM <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Sep 1998 13:22:33 -0400
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        IPC-A-610 Amendment 1 contains verbiage relative to solder balls
        under section 4.1

        Jan Pelchat


______________________________ Reply Separator _________________________________
Subject: [TN] Solder Balling Spec.
Author:  Ryan Jennens <[log in to unmask]> at 0UTG0ING
Date:    9/3/98 11:36 AM


Mornin' all-

    Is there an IPC spec which relates to how large, location, etc. of
solder balls that are located around, under, near components.  I realize
this signifies a process error, and I think I have solved it.  However,
I am still curious if IPC regulates this or not.

Ryan Jennens

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