Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 30 Sep 1998 11:40:32 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Fellow Technetters,
On some of our bare boards before build, with normal board handling,
(before ANY processing has been done) we are noticing that the solder
mask is flaking off. This condition is no longer there after wave
solder. Our impression is that the mask is not fully cured. Are there
other things that could cause this (contamination)?
Is there a test that we can perform on the bare boards to prove/test
this?
Any thoughts would be appreciated!!
Thanx in advance, group!
Jeff Hempton
Sr. Mfg. Eng'r
United Technologies Electronic Controls
email: [log in to unmask]
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|