There is no problem with tented vias under chip type parts, however the
solder mask cannot be dry film it is too thick, and if using LPI the via
better be small enough to cover it adequately.
Robert M. Wolfe

        -----Original Message-----
        From:   glenn pelkey [SMTP:[log in to unmask]]
        Sent:   Tuesday, September 29, 1998 4:41 PM
        To:     [log in to unmask]
        Subject:        [TN] Fab/Assy:  Vias under chip components

        Does anyone see a problem with placing a via under a chip capacitor?
        The via will be tented with dry film soldermask.  Assembly will be
with
        epoxy or screened solder, reflow, and DI water clean.

        The potential for electrical shorts and remaining contaminates has
us
        concerned.

        Thanks in advance for any input.

        Glenn Pelkey
        [log in to unmask]
        [log in to unmask]
        Maxtek Components Corp.

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