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September 1998

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Subject:
From:
"Alderete, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Sep 1998 10:43:16 -0700
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Jim-

I think I've read that Scanning Acoustic Microscopy (SAM) may not
reliably detect faulty or cold solder joints, BUT it may be worth
running by the people at Sonoscan Corp:

in San Jose, CA 408-456-0204

in Bensenville, IL 630-766-7088, 800-950-2NDT

-Michael Alderete



You wrote...
------------------------------

Date:    Tue, 29 Sep 1998 07:48:00 -0400
From:    Jim Marsico 516-595-5879 <[log in to unmask]>
Subject: Re: ASSY: BGA FAILURES

Well, how about it!  Does anyone have any experience using ultrasound to
detect
cracked solder joints?  Does anyone know of a testing lab that can
perform this
function?

Thanks again...

Jim Marsico


Mark wrote:

Dear Jim

This may be a very stupid idea, but what about using ultrasound?

I believe they use ultrasound to detect microscopic fractures in
mechanical
assembly's and the joint between the CBGA and the solder ball is
mechanical.

I don't know what the ultrasound would do to the chip or the wire bonds
but
it may be worth some more inquiries to the component manf.

I would be very interested to read how you got on.

------------------------------

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